Test Handler Having Size-Changeable Test Site

ABSTRACT

A test handler ( 122 ) of the present invention includes a main body, a window ( 142 ) formed on a surface of the main body and having a size corresponding to a Hi-Fix board of M×N array (where M and N represent an integer greater than a value of =), a cover ( 170 ) detachably fixed to the main body t close a part of the window and convert the window into the test site having a size corresponding to a [M−A)×(n−B)] Hi-Fix board (where A is an integer equal to ot greater than 0 but smaller than M, and B is an integer having a value other than 0). In the test handler, the size of window is easily modified to adapt that of the Hi-Fix board of M×N array by closing or opening a part of the window using the cover. Therefore, the test handler is capable of applying Hi-Fix boards having different sizes.

TECHNICAL FIELD

The present invention relates to a test handler for transferringsemiconductor devices and carrying out sorting thereof by beingconnected to semiconductor test equipment for testing the semiconductordevices or a package thereof; and, more particularly, to a test handlerhaving a size-changeable test site.

BACKGROUND ART

In order to reduce manufacturing costs for semiconductor devices, a costfor testing them needs to be reduced by shortening the test time. Tothis purpose, if a test equipment having a higher processing speed isdeveloped, a handler offering a greater throughput unit per hour is alsorequired to fully utilize the improved capability of the test equipment.

Most of semiconductor test equipments carry out test of semiconductordevices by using a Hi-Fix board having m×n sockets. That is, afteraligning the Hi-Fix board of the test equipment with a test site of ahandler, semiconductor devices loaded in inserts on a test tray arebrought into contact with the sockets on the Hi-Fix board, so that m×nsemiconductor devices can be tested at the same time. Accordingly, thesizes of the test site and the test tray are generally determined basedon the size of the Hi-Fix board. In particular, the size of the testsite is an important factor that determines the maximum throughput ofthe test handler.

FIG. 1 illustrates a schematic plan view of a Hi-Fix board 10 having 128sockets arranged in an array of 8 rows and 16 columns; and FIG. 2 setsforth a schematic front view of a main body 22, a first and a secondtest site 24 and 26 of a conventional vertical test handler 20 that isotherwise called a side-docking test handler, wherein each of the testsites 24 and 26 is designed to correspond to the Hi-Fix board 10 in FIG.1.

Each of the first and the second test site 24 and 26 is of a window typeformed on any one side of the main body 22, and a single test tray 28can be placed in each of the test sites 24 and 26. The test tray 28 isaccommodated in a certain section of the handler 20, and after beingperformed a designated internal transfer process and/or aheating/cooling process, the test tray 28 is placed in each of the firstand the second test site 24 and 26 or selectively in only one of them.Disposed behind the test tray 28 is a work press (not shown) forsupporting the test tray 28. The test tray 28 includes inserts 32corresponding to the sockets 12 of the Hi-Fix board 10. The inserts 32are arranged in an 8×16 matrix pattern, which is identical to the arrayof the sockets 12 on the Hi-Fix board 10. One or two semiconductordevices or packages to be tested (not shown) are loaded in each insert32.

If the work press behind the test tray 28 moves the test tray 28 forwardwhile the Hi-Fix board 10 of the semiconductor test equipment (notshown) is aligned with, e.g., the first test site 24 of the test handler20, the semiconductor devices loaded in the inserts 32 of the test tray28 are brought into contact with the sockets 12 of the Hi-Fix board 10,whereby tests of the semiconductor devices are carried out.

The Hi-Fix board 10 of the test equipment and the test tray 28 of thetest handler 20 need to be configured to correspond to each other, andthe Hi-Fix board 10 and the test sites 24, 26 of the test handler 20should be matched with each other. Therefore, the sizes of the testsites 24, 26 and the test tray 28 are determined depending on the sizeof the Hi-Fix board. Here, given that the size of the Hi-Fix board 10 isdetermined by the number of the sockets 12 installed thereon, which isin turn determined by the processing speed of the test equipment and thetype of test to be performed, the sizes of the test sites 24, 26 and thetest tray 28 of the test handler 20 are regarded to be dependent uponthe processing speed of the test equipment and the type of test as well.

For example, in case the test equipment has a maximum processing speedcapable of processing 128 semiconductor devices at one time for acertain test, the Hi-Fix board 10 with the 128 sockets in the 8×16 arrayas shown in FIG. 1 is generally utilized. If the Hi-Fix board 10 has anexternal size of 404 mm×344 mm to accommodate the 8×16 sockets thereon,each of the test sites 24 and 26 of the test handler 10 is formed tohave the same size as that of the Hi-Fix board 10 or slightly biggerthan that. Also, the size and the pitch of the inserts 32 on the testtray 28 should be identical to those of the sockets 12 on the Hi-Fixboard 10 to enable the tests of the semiconductor devices.

Conventionally, the test handler 20 is fabricated with the size of thetest sites 24 and 26 and the test tray 28 permanently fixed. Thus, thetest handler 20 can only be dedicated to a specific test equipment (or atest equipment having the same processing speed as that of the testequipment employed) and its exclusive Hi-Fix board 10 according to whichthe aforementioned size is determined. Further, the test handler 20cannot be used for any other higher-performance test equipment or anyother larger-size Hi-Fix board. More specifically, the conventional testhandler 20 designed for the test equipment capable of testing 128semiconductor devices at one time and the 8×16 Hi-Fix board 10 for usetherein can only be applied to them but cannot be used for a new testequipment with a faster processing speed and a larger-size Hi-Fix boardin an array of, e.g., an 8×20 matrix. This limitation in thecompatibility of the conventional test handler 20 results from the fixedsizes of each test site and the test tray and also from its therebydelimited throughput (UPH: Units Per Hour).

That is to say, even if a new test equipment provides an improvedcapability for inspecting 160 semiconductor devices at one time for acertain test, the performance of the test equipment would not be fullymanifested if the test sites and the test tray of the conventional testhandler cannot be matched with a Hi-Fix board with 160 sockets (e.g.,8×20 Hi-Fix board). With regard to the conventional structure of thetest handler, however, it is almost impossible to modify the test siteswhich were already formed. Therefore, to use the new test equipment of ahigher performance, a new test handler compatible therewith must bepurchased for the purpose of reducing the test time.

DISCLOSURE OF INVENTION

Technical Problem

It is, therefore, an object of the present invention to provide ahigh-compatibility test handler having a size-changeable test site.

Technical Solution

In accordance with the present invention, there is provided a testhandler, which includes: a main body; a window formed on a surface ofthe main body and having a size corresponding to a Hi-Fix board of M×Narray (where M and N represent an integer greater than a value of 0); acover detachably fixed to the main body to close a part of the windowand convert the window into a test site having a size corresponding to a[(M−a)×(N−b)] Hi-Fix board (where A is an integer equal to or greaterthan 0 but smaller than M, and B is an integer equal to or greater than0 but smaller than N, and where at least one of A and B is an integerhaving a value other than 0).

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects and features of the present invention willbecome apparent from the following description of preferred embodimentsgiven in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic plan view of an 8×16 Hi-Fix board having 128sockets;

FIG. 2 sets forth a schematic front view to show a main body and a firstand a second test site of a conventional vertical test handler having asize corresponding to the Hi-Fix board of FIG. 1;

FIG. 3 presents a schematic perspective view of a test handler inaccordance with a preferred embodiment of the present invention;

FIG. 4 offers a detailed perspective view to illustrate test sites ofthe test handler of FIG. 3;

FIG. 5 provides a front view of the test handler of FIG. 3 in which twotest trays are shown to be respectively exposed through the first andthe second test site in case M, N, A and B of a [(M−A)×(N−B)] Hi-Fixboard are set to have a value of 8, 2, 0 and 4, respectively;

FIG. 6 is an enlarged plan view of the first test site shown in FIG. 5and the test tray exposed therethrough;

FIG. 7 depicts a front view of the test handler of FIG. 5 from which acover is removed;

FIG. 8 shows an enlarged plan view of either one of the test sites shownin FIG. 7;

FIG. 9 schematically shows one surface of a test handler having a coverin accordance with a modification of the preferred embodiment of thepresent invention; and

FIG. 10 schematically shows one surface of a test handler having a coverin accordance with another modification of the preferred embodiment ofthe present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

Referring now to FIGS. 3 and 4, there are provided a schematicperspective view of a test handler in accordance with a preferredembodiment of the present invention and a detailed perspective view toillustrate test sites of the test handler.

The test handler 122 includes a window 142 formed in any one side of ahandler main body 122. Hi-Fix board supports 150 and 152 are installedin the window 142 such that they are extended inward. The Hi-Fix boardsupports 150 and 152 in general are made of a resin and are coupled tothe handler main body 122 via bolts (not shown) or the like. The window142 is divided into an upper window 142 a and a lower window 142 b bythe Hi-Fix board support 152, which is horizontally arranged. Each ofthe upper and the lower window 142 a and 142 b has an external sizecorresponding to an M×N Hi-Fix board (not shown) (for example, M=8,N=20).

On the right and left side of the window 142, first and second lockingdevices 160 and 162 are connected to the handler main body 122 via bolts(not shown) or the like. The first and the second locking devices 160and 162 are used to fix a Hi-Fix board (as shown in FIG. 1) in thewindow 142. As clearly shown in FIG. 4, the first locking device 160includes a first locking cylinder 160 a, a first locking clamp 160 b anda first clamp guide block 160 c, while the second locking device 162includes a second locking cylinder 162 a, a second locking clamp 162 band a second clamp guide block 160 c. In the preferred embodiment of thepresent invention, the first and the second locking cylinders 160 a and162 a are substantially same components, and the second locking clamps162 b and the second clamp guide blocks 162 c are elongated in ahorizontal direction longer than the first locking clamps 160 a and thefirst clamp guide blocks 160 c, i.e., the lengths of the second lockingclamps 162 b and the second clamp guide blocks 162 c are configured tobe longer than those of the first locking clamps 160 b and the firstclamp guide blocks 160 c, to support a cover 170 and so forth. However,it should be noted that the test handler 122 in accordance with thepresent invention is not limited to this configuration.

Some area of the window 142 is closed by a vertically elongatedrectangular cover 170. Accordingly, the widths of the upper and thelower window 142 a and 142 b are reduced by the presence of the cover170. The upper and the lower window 142 a and 142 b having the reducedwidths define a first and a second test site 124 and 125, respectively.Each of the first and the second test site 124 and 125 has a sizecorresponding to a [(M−A)×(N−B)] Hi-Fix board (for example, M=8, N=20,A=0, B=4).

The cover 170 includes a support portion 172 and an extension portion174 (see, FIG. 5), wherein the support portion 172 is made of a metalsimilar or identical to that forming the handler main body 122 while theextension portion 174 is made of an insulating resin material similar oridentical to that forming the Hi-Fix board supports 150 and 152.Further, the support portion 172 of the cover 170 is fixed on thehandler main body 122 by means of the second clamp guide blocks 162 c ofthe second locking devices 162; however, the present invention is notlimited thereto. For example, the support portion 172 can be fastened tothe handler main body 122 directly by using bolts or the like.

The extension portion 174 of the cover 170 has the same function asthose of the Hi-Fix board supports 150 and 152. That is, when matchingeach of the test sites 124 and 125 with a Hi-Fix board, the extensionportion 174 of the cover 170 and the Hi-Fix board supports 150 and 152jointly support the edge portion of the Hi-Fix board.

If the cover 170 is detached from the test handler 120 configured asdescribed above, the upper and the lower window 142 a and 142 bcorresponding to the external size of the M×N Hi-Fix board are exposed,so that it is possible to use the upper and the lower window 142 a and142 b as test sites for the M×N Hi-Fix board.

In accordance with the present invention, in case of attaching the cover170 to the handler main body 122, the first and the second test site 124and 126 corresponding to the [(M−A)×(N−B)] Hi-Fix board (A=0) can beobtained, so that it is possible to use the test handler 120 for the[(M−A)×(N−B)] Hi-Fix board (A=0). On the other hand, if the cover 170 isremoved from the handler main body 122, the upper and the lower window142 a and 142 b each corresponding to the M×N Hi-Fix board are exposed,so that it is possible to use the test handler 120 for the M×N Hi-Fixboard. That is, the test handler 120 can be used for both the[(M−A)×(N−B)] Hi-Fix board (A=0) and the M×N Hi-Fix board. Here, ifthere is a likelihood that the M×N Hi-Fix board may be interfered bysuch components as the second locking devices 162 when the test handler120 is applied to the M×N Hi-Fix board, those components need to beremoved or replaced.

FIG. 5 is a front view showing a state where test trays 128 and 130 areexposed through the first and the second test site 124 and 126 of thetest handler 120 shown in FIG. 3 when M, N, A and B are set to have avalue of 8, 20, 0 and 4, respectively. FIG. 6 presents an enlarged planview of the first test site 123 and the test tray 28 exposed outsidetherethrough. In FIG. 6, the areas marked by ‘◯’ are where inserts 132are installed to be used for test, whereas the areas marked by ‘x’ donot accommodate inserts thereon or will not be used for test even thoughinserts are installed thereon.

The test tray 128 shown in FIGS. 5 and 6 has 8×16 inserts on appropriatelocations thereon to be applied to an 8×16 Hi-Fix board. However, thistray 128 can also be applied to an 8×20 Hi-Fix board simply byinstalling additional inserts thereon. Specifically, in case of applyingthe test tray 128 to the 8×16 Hi-Fix board, inserts are installed on theentire area of the test tray 128 except on the area in the first to thethird columns from the cover 170 (i.e., the first three columns from theleft side of FIG. 6) and on the area in the first column from theopposite side (i.e., the rightmost column in FIG. 6). On the other hand,in case of applying the test tray 128 to the 8×20 Hi-Fix board, insertsare installed on the entire area of the test tray 128. Though it ispossible to apply such a test tray 128 to the 8×16 Hi-Fix board, it ismore preferable to use the test tray 128 by changing the number ofinserts installed thereon because the inserts are of a high price. Thatis to say, in accordance with the present invention, the test tray 128can be used for both the 8×16 Hi-Fix board and the 8×20 Hi-Fix board.Therefore, component sharing is possible, thus resulting in a reductionof manufacturing costs.

FIG. 7 is a front view showing a test handler 120 from which its cover170 is removed to be applied to an 8×20 Hi-Fix board, and FIG. 8 setsforth an enlarged plan view of one of the two test sites of the testhandler 120. Second locking devices 180 in FIG. 7 can be the samecomponents as first locking devices 160 or they can be configured byremoving some parts such as the second clamps 162 a and the second clampguide blocks 162 c from the second locking devices 162 shown in FIG. 4or replacing them by other elements.

As illustrated in FIG. 7, if the cover 170 shown in FIG. 5 is removed,the entire area of the window 142 is exposed, whereby it becomespossible to use the upper and the lower window 142 a and 142 b, eachhaving a width larger than those of the first and the second test sites124 and 126 in FIG. 5, as a new first and a new second test site eachcorresponding to the 8×20 Hi-Fix board. In this case, inserts 132 areinstalled on the entire area of the test tray 128 as shown in FIG. 8,wherein the inserts 132 match with sockets of the 8×20 Hi-Fix board inone-to-one correspondence in terms of their sizes and pitches.

Though the preferred embodiments have been described for the case ofusing the vertically elongated rectangular cover 170, the cover can beof various shapes. Below, various modifications of the cover will bedescribed in detail.

FIG. 9 provides a schematic view illustrating another modification of acover attached to any one surface of a test handler.

In a test handler 120, a window 142 is closed by a cover 170 a. Thecover 170 a is provided with a central opening through which an upperand a lower window 142 a and 142 b are partially exposed. Other than theareas exposed through the central opening of the cover 170 a, rest areas180 (as indicated by shaded portions) of the upper and the lower window142 a and 142 b are closed by the cover 170 a. Accordingly, a horizontaland/or a vertical width of the upper and the lower window 142 a and 142b are reduced by the presence of the cover 170 a. In this example shownin FIG. 9, some upper rows of the upper window 142 a and some lower rowsof the lower window 142 b can be closed by the cover 170 a at the sametime.

The upper and the lower window 142 a and 142 b having reduced areas bythe cover 170 a form a first test site 124 a and a second test site 126a, respectively. Each of the first and the second test site 124 a and126 a has a size corresponding to a [(M−A)×(N−B)] Hi-Fix board (forexample, M=8, N=20, A=4, B=0).

Test trays mounted in the upper and the lower window 142 a and 142 b areconnected to respective [(M−A)×(N−B)] Hi-Fix boards (for example, M=8,N=20, A=4, B=0), so that semiconductor devices loaded in inserts of thetest trays can be inspected.

The cover 170 a is a rectangular plate member having a central opening.The first and the second test site 124 a and 126 a are exposed outsidethrough the central opening of the cover 170 a. The cover 170 a is madeof a metal material similar or identical to that forming the handler 122or a resin material similar or identical to that forming the Hi-Fixboard supports 150 and 152. Further, though the cover 170 a is fastenedto the Hi-Fix board support 150 via bolts 190 in the example shown inFIG. 9, other connection or fastening mechanism can be employed instead.For example, the cover 170 a can be connected to the handler main body122 by using the first and the second locking device 160 and 162described above in accordance with the preferred embodiment of thepresent invention.

If the cover 170 a is removed from the test handler 120, the upper andthe lower window 142 a and 142 b each corresponding to a M×N Hi-Fixboard are exposed, so that it is possible to use each of the upper andthe lower window 142 a and 142 b as a test site for the M×N Hi-Fixboard.

That is, if the cover 170 a is attached to the handler main body 122,the first and the second test site 124 a and 126 a each corresponding tothe [(M−A)×(N−B)] Hi-Fix board (for example, M=8, N=20, A=4, B=0) areobtained. Therefore, the test handler 120 in accordance with the presentinvention can be applied to the [(M−A)×(N−B)] Hi-Fix board. On the otherhand, if the cover 170 a is separated from the handler main body 122,the upper window 142 a and the lower window 142 b each corresponding tothe external size of the M×N Hi-Fix board are exposed to be used as testsites themselves. Accordingly, it becomes also possible to apply thetest handler 120 to the M×N Hi-Fix board.

FIG. 10 presents a schematic view illustrating further anothermodification of a cover attached to any one surface of a test handler.

Though the cover 170 a in FIG. 9 is configured to close some rows of theupper and the lower window 142 a and 142 b, a cover 170 b in thisexample has a one-side opened rectangular shape and closes some rows andsome columns of the upper and the lower window 142 a and 142 b at thesame time (shaded portions 195 in the figure represent the areas closedby the cover 170 b).

Accordingly, when the cover 170 b is applied, the upper and the lowerwindow 142 a and 142 b are respectively converted into a first and asecond test site 124 a and 126 b each corresponding to a [(M−A)×(N−B)]Hi-Fix board (for example, M=8, N=20, A=4, B=4).

The mechanism for attaching or detaching the cover 170 b to or from thehandler main body 122 and the function of the cover 170 a are identicalto those described in the foregoing example using the cover 170 a.

In the example shown in FIG. 10, though the cover 170 b has the one-sideopened rectangular shape to convert the upper and the lower window 142 aand 142 b into the first and the second test site 124 b and 126 b eachcorresponding to the [(M−A)×(N−B)] Hi-Fix board (for example, M=8, N=20,A=4, B=4), the cover 170 b can also be fabricated as a plate memberhaving a left half-bracket shape, a right half-bracket shape, arectangular shape with an opening or a combination of a left- and aright-bracket shape. In each of the cases, the upper and the lowerwindow 142 a and 142 b can be converted into a first and a second testsite 124 a and 124 b each corresponding to a [(M−A)×(N−B)] Hi-Fix board,though not shown in the drawing.

As can be seen from FIGS. 3 to 10, the test handler 120 in accordancewith the preferred embodiments of the present invention or themodifications thereof can be applied to two types of Hi-Fix boardshaving different external sizes (for example, an 8×16 Hi-Fix board andan 8×20 Hi-Fix board). Accordingly, in case an old-model test equipmentis replaced by a new test equipment featuring a higher processing speed,by using the test handler 120 in accordance with the present invention,it is possible to increase the maximum throughput unit per time of thetest handler 120 without having to replace the test handler 120 with anew one. Moreover, even in case the new higher-performance testequipment is purchased, the old-model equipment is usually utilizedtogether. In such as case, the test handler in accordance with thepresent invention can be applied to both of the new and the old-modeltest equipment. Therefore, the test handler in accordance with thepresent invention has many advantages when it is applied to themanufacture of semiconductors.

While the invention has been shown and described with respect to thepreferred embodiments, it will be understood by those skilled in the artthat various changes and modifications may be made without departingfrom the spirit and scope of the invention as defined in the followingclaims.

1. A test handler comprising: a main body; a window formed on a surfaceof the main body and having a size corresponding to a Hi-Fix board ofM×N array (where M and N represent an integer greater than a value of0); and a cover detachably fixed to the main body to close a part of thewindow and convert the window into a test site having a sizecorresponding to a [(M−A)×(N−B)] Hi-Fix board (where A is an integerequal to or greater than 0 but smaller than M, and B is an integer equalto or greater than 0 but smaller than N, and where at least one of A andB is an integer having a value other than 0). 2-3. (canceled)
 4. Thetest handler of claim 1 wherein the window is converted into a test sitecorresponding to the M×N Hi-Fix board by separating the cover from themain body.
 5. The test handler of claim 1, wherein M, N, A and B have avalue of 8, 20, 0 and 4, respectively.
 6. The test handler of claim 5,further comprising an 8×20 test tray installed in the window.
 7. Thetest handler of claim 6, wherein 128 inserts in a matrix of 8 rows and16 columns are arranged on the entire area of the 8×20 test tray excepton the first three columns of the test tray from the cover and on thefirst column from the opposite side, and all of the 128 inserts areexposed through the test site.
 8. The test handler of claim 6, wherein160 inserts in a matrix of 8 rows and 20 columns are arranged on theentire area of the 8×20 test tray.
 9. The test handler of claim 8,wherein at least 128 inserts among the 160 inserts are exposed throughthe test site, and the rest 32 inserts are at least partially closed bythe cover.
 10. The test handler of claim 8, wherein all of the 160inserts are exposed through the window if the cover is removed.
 11. Atest handler comprising: a main body; a plurality of windows formed on asurface of the main body, each of which has a size corresponding to aHi-Fix board of M×N array (where M and N represent an integer greaterthan a value of 0) and corresponds to a test tray; and a coverdetachably fixed to the main body to close parts of the windows andconvert each of the windows into a test site having a size correspondingto a [(M−A)×(N−B)] Hi-Fix board (where A is an integer equal to orgreater than 0 but smaller than M, and B is an integer equal to orgreater than 0 but smaller than N, and where at least one of A and B isan integer having a value other than 0), the cover supporting the[(M−A)×(N−B)] Hi-Fix boards.
 12. The test handler of claim 11, whereinthe cover is a plate member having a central opening.
 13. The testhandler of claim 11, wherein the cover is a rectangular plate member.14. The test handler of claim 11, wherein each of the windows isconverted into a test site corresponding to the M×N Hi-Fix board byseparating the cover from the main body.
 15. The test handler of claim11, wherein a test tray used in testing semiconductor devices with theM×N Hi-Fix board has the same outer size as a test tray used in testingsemiconductor devices with the [(M−A)×(N−B)] Hi-Fix board.
 16. The testhandler of claim 15, wherein the test tray used in testing semiconductordevices with the [(M−A)×(N−B)] Hi-Fix board has inserts at portionscorresponding to the [(M−A)×(N−B)] Hi-Fix board.
 17. The test handler ofclaim 15, wherein the test tray used in testing semiconductor deviceswith the M×N Hi-Fix board is the same as the test tray used in testingsemiconductor devices with the [(M−A)×(N−B)] Hi-Fix board.
 18. A methodfor testing semiconductor devices by using a test handler having aplurality of windows, the method comprising: converting each of thewindows from a test site corresponding to a Hi-Fix board of M×N array(where M and N represent an integer greater than a value of 0) into atest site corresponding to a [(M−A)×(N−B)] Hi-Fix board (where A is aninteger equal to or greater than 0 but smaller than M, and B is aninteger equal to or greater than 0 but smaller than N, and where atleast one of A and B is an integer having a value other than 0) or viceversa; and testing semiconductor devices with the M×N Hi-Fix board orthe [(M−A)×(N−B)] Hi-Fix board.
 19. The method of claim 18, wherein atest tray used in testing semiconductor devices with the M×N Hi-Fixboard has the same outer size as a test tray used in testingsemiconductor devices with the [(M−A)×(N−B)] Hi-Fix board.
 20. Themethod of claim 19, wherein the test tray used in testing semiconductordevices with the [(M−A)×(N−B)] Hi-Fix board has inserts at portionscorresponding to the [(M−A)×(N−B)] Hi-Fix board.
 21. The method of claim19, wherein the test tray used in testing semiconductor devices with theM×N Hi-Fix board is the same as the test tray used in testingsemiconductor devices with the [(M−A)×(N−B)] Hi-Fix board.
 22. Asemiconductor device subjected to a test by using the test handlerdescribed in claim 1.